Kulicke & Soffa

IConn

Packaging & Bonding Kulicke & Soffa IConn family

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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The K&S IConn is a wire bonder made by Kulicke & Soffa. The IConn wire bonder operates on a 50/60 Hz electrical supply. The IConn wire bonder is rated for an interrupt capacity of 5000 A and an over-current rating of 1000 A per 10 ms.^[1]

IConn — Inventory photo — Fig. 01IConnInventory photo^[1]

What it is

The Kulicke & Soffa IConn is a wire bonder used in semiconductor packaging. A variant, the IConn PLUS, is also produced. The IConn wire bonder operates at 50/60 Hz and has an interrupt capacity of 5000 A and an over current rating of 1000 A for 10 ms.^[1]

Where it fits in the process flow

General reference — not yet source-verified

Wire bonders are used in the semiconductor assembly process after wafer dicing and die attach. The bonded devices then proceed to encapsulation and testing.

What do the numbers mean?

Power & electrical3

50/60 Hz^[1]
Electrical supply frequency: 50/60 Hz^[1]
Frequency: 50/60 Hz^[1]

Configuration & options7

Interrupt Capacity: 5000 A^[1]
Over Current: 1000 A / 10 ms^[1]
Over-current rating: 1000 A / 10 ms^[1]
Example unit build year: 2011^[1]
Example unit build year: 2012^[2]
Vintage: 2011^[1]
Vintage: 2012^[2]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
IConn PLUS Wire Bonder	—	—	—	web.archive.org^[8]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Configuration50/60 Hz^[1]
Electrical supply frequency50/60 Hz^[1]
Frequency50/60 Hz^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

How does this class of machine ensure bonding quality and reliability?General reference — not yet source-verified

Quality is ensured through closed-loop process control, real-time vision alignment, bond force and ultrasonic power monitoring, and in-line pull and shear testing capabilities. Many systems also include optical inspection to detect defects.

What is the typical throughput range for such bonding systems?General reference — not yet source-verified

Throughput varies widely by machine class and application, but modern automated bonders can achieve high units per hour by employing dual-bond-head configurations, advanced motion control, and optimized processes. Specific values are model-dependent.

Not publicly documented

The following facts about the IConn are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IConn are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the IConn are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IConn are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IConn is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the IConn are on record.
Answerable by: an OEM parts catalog or a service engineer