KLA
2138
The KLA-2138 is an inline wafer inspection system from KLA-Tencor. The KLA-2138 uses an ultra-broadband illumination source combined with improved brightfield optics and Segmented Auto Threshold (SAT) technology. The KLA-2138 detects a wide range of yield-relevant defect types on all process layers at speeds required for high-volume wafer production.[1]
What it is
The KLA 2138 is a wafer inspection system.[1]
The KLA 2138 is a brightfield inline inspection tool for detecting yield-limiting defects on process wafers.[1]
How it works
Applications
The KLA 2138 detects yield-relevant defect types on process layers.[1]
- Inline inspection of process layers
- Detection of yield-limiting defects
- Defect inspection on wafers
What do the numbers mean?
Wafer handling2
Optics & imaging4
Configuration & options6
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of defects can this class of machine detect?General reference — not yet source-verified
Machines in this class are designed to detect a broad range of defects including pattern defects, particles, scratches, cracks, film non-uniformities, and embedded foreign material. The detection capability depends on the illumination mode (brightfield vs. darkfield) and the optical resolution.
How does the inspection sensitivity compare between different optical modes?General reference — not yet source-verified
Brightfield mode is generally better for detecting subtle pattern deviations and film thickness variations, while darkfield mode offers higher sensitivity to small particles and edge irregularities. Many such systems allow switching between modes or using simultaneous illumination to capture a wider defect spectrum.
Can this machine be used for both front-end and back-end semiconductor processes?General reference — not yet source-verified
Yes, optical inspection tools of this class are typically used throughout the entire wafer fabrication flow, from front-end layers like gate and shallow trench isolation to back-end metallization and passivation layers. The optical setup may require adjustments for different film stacks and topography.
What are the typical throughput considerations for such systems?General reference — not yet source-verified
Throughput is a function of scan speed, pixel resolution, and number of inspection passes. Production systems balance sensitivity with throughput by adjusting stage acceleration, data acquisition rate, and algorithm complexity. Higher resolutions and multiple inspection passes reduce throughput but may be necessary for advanced defect detection.
How is the machine calibrated to ensure consistent defect detection?General reference — not yet source-verified
Calibration involves standard reference wafers with known defect sizes and types to tune the optical alignment, detector gain, and defect detection algorithm. Periodic recalibration using built-in test patterns and external standards ensures that sensitivity remains stable over time and across different machine recipes.
Not publicly documented
The following facts about the 2138 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2138 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2138 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2138 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2138 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2138 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]KLA-Tencor Web Site --- The IC Manufacturing Process 7 — web.archive.orgweb.archive.org
- [3]KLA-Tencor Web Site --- The IC Manufacturing Process 3 — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.
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