Hitachi
CM 700 X
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Hitachi CM 700 X is a die bonder. The Hitachi CM 700 X is made by Hitachi. The Hitachi CM 700 X model designation is CM 700 X.[1]
What it is
The Hitachi CM 700 X is a die bonder.[1]
How it works
General reference — not yet source-verifiedA die bonder such as the Hitachi CM 700 X picks a die from a diced wafer or a tape-and-reel carrier and places it onto a substrate with precision alignment. The bonding process commonly uses epoxy dispensing, eutectic soldering, or adhesive curing to secure the die. The placement head typically employs a vacuum collet or a gripper to handle the die without damage.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonders operate in the semiconductor packaging flow after wafer dicing and before wire bonding or encapsulation. Upstream processes include wafer sawing and die inspection. Downstream steps include wire bonding, molding, and final testing. The die bonder plays a critical role in establishing the mechanical and thermal interface between the die and the package.
What do the numbers mean?
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the CM 700 X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CM 700 X are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CM 700 X are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CM 700 X are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CM 700 X are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CM 700 X is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Oct 7, 2026.
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