Hesse & Knipps
Bondjet BJ885
The Bondjet BJ885 is a fully automatic fine wire bonder from Hesse. The Bondjet BJ885 supports wedge-wedge and ball-wedge bondheads. The Bondjet BJ885 provides a working area of 370 mm x 870 mm with a Z stroke of 19 mm.[1]
Plate 01Fine Wire Bonder: Bondjet BJ885 and Bondjet BJ855
Hesse MechatronicsWatch on YouTube
What it is
The Bondjet BJ885 is a fully automated fine wire bonder for wedge-wedge and ball-wedge bonding.[1]
How it works
The Bondjet BJ885 uses wedge-wedge and ball-wedge bondheads, optimized pattern recognition, and Hesse Assist Tools such as load cell, bondtool detection, and bondtool calibration without wedge gauge.[1]
The Bondjet BJ885 includes continuous real time monitoring of wire deformation, transducer current, frequency, and impedance within programmable control limits, and it offers process integrated quality control as an option.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe Bondjet BJ885 is used in assembly operations that create wire interconnects between semiconductors, substrates, and package elements after device fabrication and before final package completion.
Applications
The Bondjet BJ885 is intended for components in HF and RF technology, chip-on-board assemblies, multichip modules, hybrids, optical electronics, and automotive electronics.[1]
- HF and RF technology
- COB (chip-on-board)
- Hybrids
- Optical electronics
- Automotive electronics
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
- Media connectivity
- Gigabit-Ethernet (TCP/IP), USB-Ports, HDMI, compressed air (CDA clean, dry air), vacuum[1]
Dimensions & facilities3
- Ribbon dimensions
- Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm (1.4 mil x 0.25 mil up to 10 mil x 1 mil)[1]
Configuration & options11
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Bondjet BJ855 | — | — | Working area X 305 mm, Y 410 mm, Z 19 mm; footprint 740 x 1484 x 1912 mm; weight ca. 1150 kg | hesse-mechatronics.com[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bond methods does the Bondjet BJ885 support?
The Bondjet BJ885 supports wedge-wedge bonding and ball-wedge bonding.[1]
Not publicly documented
The following facts about the Bondjet BJ885 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Bondjet BJ885 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Bondjet BJ885 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Bondjet BJ885 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Bondjet BJ885 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Bondjet BJ885 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]hesse-mechatronics.com — hesse-mechatronics.comhesse-mechatronics.com
Last updated Oct 9, 2026.
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