Finetech
A 4 V HD 700
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedBonders of this class are used in semiconductor packaging and assembly lines after wafer fabrication, where dies are joined to substrates, lead frames, or packages.
The machine sits upstream of subsequent packaging steps such as encapsulation, singulation, and final test.
Applications
General reference — not yet source-verifiedThermocompression and thermosonic bonding are used for interconnecting semiconductor dies, for die attachment, and for joining components in hybrid and multichip assemblies.
What do the numbers mean?
Configuration & options9
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the A 4 V HD 700 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the A 4 V HD 700 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the A 4 V HD 700 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the A 4 V HD 700 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the A 4 V HD 700 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the A 4 V HD 700 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]A 4 V HD 700 — Finetech | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]Finetech A 4 V HD 700 family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 10, 2026.
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