EV Group
The EV Group 310 is a single-wafer cleaner. The EV Group 310 includes a megasonic DI water cleaning function. The EV Group 310 includes a pre-bond station with infrared lamp imaging.[1]
The EVG 310 operates under the EVG CIMFramework unified software platform, which provides a common graphical user interface for the bonding tool family. The tool uses a Jobs tab to start recipes.[1]
In the cleaning module, wafers are cleaned using megasonic DI water. The pre-bond station allows two wafers to be brought into contact manually after alignment, with a center bond pin applying small pressure to initiate pre-bonding.[1]
The infrared imaging module uses an infrared lamp and camera to capture images through the wafer stack, revealing bonding defects such as voids. Images are saved to a Data drive under D:\ProcessData\Pictures.[1]
A full process sequence on the EVG 310 includes cleaning of the first wafer, transferring it to the pre-bond station, cleaning the second wafer, aligning the two wafers manually, initiating contact by retracting a separation flag, applying pressure with a bond pin, and capturing an infrared image of the stack. The bonded stack is then ready for unloading.[1]
Process applications and technology nodes documented for this tool.
Documented failure modes, common issues, and field considerations.
Control-system eraunified GUI program platform called EVG CIMFramework[1]
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The EVG 310 consists of a cleaning module (CLM) and a pre-bond station with infrared lamp imaging module (IRM).[1]
Jobs are started from the Jobs tab in the EVG CIMFramework interface by pressing the Add Job button and selecting a recipe from the EPFL Recipes folder.[1]
Four standard recipes are available: EVG_Standard_Cleaning_ProcessFlow (cleaning only), EVG_Standard_Bonding_ProcessFlow (pre-bond and IR imaging only), EVG_Cleaning_and_Bonding_FullProcessFlow (both modules), and IR Imaging (IR imaging of already bonded stacks).[1]
IR images are stored in the Data drive under D:\ProcessData\Pictures, organized by year and month.[1]
The following facts about the 310 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 310 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 310 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The process node or technology generation of the 310 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 310 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 310 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Oct 9, 2026.