EV Group
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EVG 120 is an automated resist processing system from EV Group. EVG 120 supports wafers up to 200 mm. EVG 120 offers spin coating, spray coating, and developing.[1][2][3]
The EV Group 120 is an automated resist processing system.[2]
The EV Group 120 is a coating and developing tool used for lithography-related resist processing.[1]
The EV Group 120 is a wafer-processing machine that supports spin coating, spray coating, and developing.[2]
The EV Group 120 supports wafers up to 200 mm.[2]
The EV Group 120 serves low-volume manufacturing and high-volume manufacturing.[2]
The EV Group 120 supports applications in photolithography, wafer bonding, and nanoimprint lithography.[2]
The EV Group 120 processes thin resists, thick resists, dielectrics, colored resists, and adhesives.[2]
The EV Group 120 supports coating thickness from 100 nm to several hundred µm.[2]
The EV Group 120 supports applications in advanced packaging, MEMS, image sensors, photonics, power devices, wafer probe cards, and other semiconductor device areas.[3]
The EV Group 120 supports resist materials including positive tone and negative tone resists, dielectric materials such as PI and PBO, and black, color, and IR resists.[3]
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Throughput depends on the number of coating and development modules, the process recipe (spin times, bake durations, cool-down periods), and the degree of parallelism. Systems in this class can process multiple substrates per hour, with some high-end track systems achieving very high throughput for volume production. For a mid-range standalone tool, throughput is generally a few tens of wafers per hour.
Uniformity is controlled by several factors: the spin speed profile (acceleration and final speed), the dispense method (static or dynamic), the substrate chuck design, and the surrounding airflow. Automated tools use precision dispense pumps and closed-loop speed control to maintain repeatability. Edge-bead removal and backside rinse features further ensure that the film is consistent and free of defects near the substrate edge.
The following facts about the 120 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 120 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 120 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 120 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 120 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 120 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 3, 2026.