Esec
2100 sD advanced i
The Esec 2100 sD advanced i is a die bonder for epoxy die attach applications. The Esec 2100 sD advanced i is a 3rd generation 300 mm high speed platform. The Esec 2100 sD advanced i has bonding accuracy of 20 µm @ 3σ, with a 15 µm option.[1]
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
General reference — not yet source-verifiedA die bonder places semiconductor dies onto a substrate or leadframe and then bonds them in a packaging flow. Die bonding equipment of this class is used for attachment steps before later package assembly operations.
How it works
The Esec 2100 sD advanced i supports epoxy die attach applications. The Esec 2100 sD advanced i supports hot and cold processes, including epoxy, soldering, thermo-compression, and eutectic processes.[1]
The Esec 2100 sD advanced i uses pick-and-place motion to position dies with high accuracy. The Esec 2100 sD advanced i uses a Phi-Y concept with rotational and linear movements, and the platform includes real-time process monitoring, status control, and operator guidance features.[1]
Where it fits in the process flow
Applications
The Esec 2100 sD advanced i is intended for QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA applications. The Esec 2100 sD advanced i also supports leadframes with lengths from 90 mm to 300 mm and widths from 23 mm to 100 mm.[1]
- TSOP
- FBGA
What do the numbers mean?
Wafer handling1
Performance1
Dimensions & facilities2
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What die attach methods does the Esec 2100 sD advanced i support?
The Esec 2100 sD advanced i supports epoxy die attach. The Esec 2100 sD advanced i also supports soldering, thermo-compression, and eutectic processes.[1]
What placement accuracy is specified for the Esec 2100 sD advanced i?
The Esec 2100 sD advanced i is specified at 20 µm bonding accuracy at 3σ. The Esec 2100 sD advanced i has a 15 µm accuracy option.[1]
What machine size is specified?
The Esec 2100 sD advanced i is specified with machine dimensions of 1785 by 1448 by 1400 mm.[1]
Not publicly documented
The following facts about the 2100 sD advanced i are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 sD advanced i are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2100 sD advanced i are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2100 sD advanced i are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2100 sD advanced i are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2100 sD advanced i is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 9, 2026.
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