CyberOptics
SE 350 SPI
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedSolder paste inspection machines examine printed solder deposits on circuit assemblies before component placement and reflow.
An SPI system measures paste placement quality so process operators can detect print defects, monitor stencil performance, and control solder deposition consistency.
Where it fits in the process flow
General reference — not yet source-verifiedSolder paste inspection sits after solder paste printing and before component placement in the assembly flow.
The inspection step supports print-process control by checking paste volume, alignment, and print uniformity before boards move downstream.
Applications
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Missing X and Y servos
- Non-operational
What do the numbers mean?
Optics & imaging1
Configuration & options9
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kinds of defects can this class of system detect?General reference — not yet source-verified
Typical class-level defects include insufficient or excessive solder paste, missing deposits, registration offset, smearing, and conditions that may lead to solder bridging. The system also reports height and volume distributions for process monitoring.
Not publicly documented
The following facts about the SE 350 SPI are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SE 350 SPI are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SE 350 SPI are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SE 350 SPI are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the SE 350 SPI is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SE 350 SPI are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]CyberOptics SE 350 SPI family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
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