Cohu

The Cohu Matrix II DM 8888 is a semiconductor test and probe handler. The equipment is a Cohu / Delta Design Matrix II / DM 8888 Handler.[1]
The Matrix II DM 8888 is specified with CDA, thermal purge, and LN2 supply conditions that support temperature-dependent test handling. The handler is also specified with package support for QFP, BGA, LGA, QFN, and TSOP.[1]
A test and probe handler sits in the semiconductor test flow where packaged devices or probed devices are prepared for electrical evaluation. The handler is used after device preparation and before final test disposition in automated test handling.
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The Matrix II DM 8888 is specified for QFP, BGA, LGA, QFN, and TSOP package types.[1]
The Matrix II DM 8888 is specified with IEEE 488.1 GPIB and RS-232 interfaces.[1]
The Matrix II DM 8888 is specified with Windows XP as the operating system.[1]
The Matrix II DM 8888 is specified for JEDEC tray handling.[1]
The following facts about the Matrix II DM 8888 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Matrix II DM 8888 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Matrix II DM 8888 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Matrix II DM 8888 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Matrix II DM 8888 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Matrix II DM 8888 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 13, 2026.
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