CHA
Mark 50
What it is
The CHA Mark 50 is a thin-film physical vapor deposition system.[3]
The CHA Mark 50 is a CHA model Mark 50 system with a six-inch wafer size specification.[3]
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThin-film deposition is a front-end or middle-of-line process step that follows substrate preparation and precedes later patterning, etching, or thermal integration steps.
Physical vapor deposition is used when a process flow needs a deposited film for conductors, barriers, or functional layers before subsequent lithography and etching define the final device structure.
Applications
What do the numbers mean?
Power & electrical2
- New glassman voltage[1]
Wafer handling1
Control & software4
Configuration & options3
- updated Infinicon[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Applied Materials Endura 5500— Same function class: Deposition, nullCompare in depthsource[6]
- Applied Materials Endura 5500 IMP— Same function class: Deposition, nullCompare in depthsource[6]
- Applied Materials Endura 2— Same function class: Deposition, nullCompare in depthsource[6]
Related models
- siblingCHA Mark-40— The source presents Mark-50 alongside Mark-40 and states Mark-40 combines the best features of the Mark 50 system.source[5]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of deposition system is the CHA Mark 50?
The CHA Mark 50 is a physical vapor deposition (PVD) system.[3]
In which industries is the CHA Mark 50 used?
The CHA Mark 50 supports applications in advanced energy, aerospace, and electronics.[4]
Is the CHA Mark 50 part of a product family?
Yes, the Mark 50 is part of the CHA Mark Series of thin-film deposition systems.[4]
Not publicly documented
The following facts about the Mark 50 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Mark 50 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Mark 50 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Mark 50 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Mark 50 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Mark 50 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
- [4]web.archive.org — chaindustries.com (Apr 20, 2026)web.archive.org
- [5]web.archive.orgweb.archive.org
- [6]Equipment Resources | CNF — cnf.cornell.educnf.cornell.edu
Last updated Oct 2, 2026.
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Applied Materials Endura 2 is a 12-inch PVD (physical vapor deposition) system used for liner/barrier and front-end metallization applications.
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The Applied Materials Endura 5500 IMP is a deposition tool configured as a PVD system for 8-inch wafers.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.