Bruker
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Jordan Valley JVX 6200 is an X-ray metrology tool, capable of X-ray reflectivity (XRR) and small-spot X-ray fluorescence (XRF). The Jordan Valley JVX 6200 processes 200 mm wafers, 300 mm wafers, or 12-inch wafers depending on configuration.[1][2]
X-ray reflectivity works by directing a collimated X-ray beam at a grazing angle onto the wafer surface and measuring the reflected intensity as a function of angle. The resulting interference pattern reveals the thickness, density, and roughness of thin films.
X-ray fluorescence uses a focused X-ray beam to excite atoms in the film, which then emit characteristic fluorescent X-rays. An energy-dispersive detector analyzes the emitted spectrum to determine elemental composition and stoichiometry.
Primary applications include measurement of thickness and density for dielectric films such as silicon dioxide and silicon nitride, metal films such as copper and aluminum, and barrier layers. The XRF mode provides elemental composition analysis for alloy films and dopant concentration in transparent layers.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
X-ray metrology systems can measure solid samples such as semiconductor wafers, coated glass or optics, and thin-film stacks on various substrates. The technique is non-destructive and can handle samples ranging from small test coupons to full production wafers or parts.
Yes, X-ray metrology is inherently non-destructive because X-rays pass through the material without causing damage, provided the exposure levels are within standard limits. The sample remains intact and can be used for further processing or analysis.
Common parameters include film thickness (for single and multiple layers), density, surface and interface roughness, elemental composition, crystallinity, lattice strain, and residual stress. The exact set of available parameters depends on the measurement mode (XRR, XRF, XRD) and the system configuration.
The following facts about the Jordan Valley JVX 6200 X-ray Metrology are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Jordan Valley JVX 6200 X-ray Metrology are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Jordan Valley JVX 6200 X-ray Metrology are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Jordan Valley JVX 6200 X-ray Metrology are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Jordan Valley JVX 6200 X-ray Metrology are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Jordan Valley JVX 6200 X-ray Metrology is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Oct 6, 2026.
The KLA .204 PSL Wafer is an 8-inch NIST-traceable reference wafer compatible with Surfscan 6xy0 and Sp1 particle counters.
KLA .496 PSL Wafer is an 8-inch NIST traceable wafer stated to be capable on Surfscan 6xy0 and SP1.
The KLA .498 PSL Wafer is a NIST traceable reference wafer.