Besi
2100 FC hS
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Besi 2100 FC hS is a die bonder with flip chip capability. The Besi 2100 FC hS is a flip chip bonder. The Besi 2100 FC hS supports wafer sizes from 4 to 12 inches.[1][2][3]
What it is
How it works
The Besi 2100 FC hS uses flip chip bonding and supports process functions that include dispensing, vision alignment, fluxing, wafer handling, strip handling, and magazine handling.[1]
The Besi 2100 FC hS uses real-time process monitoring with live images of the process zone and status control for wafer, strip, and magazine handling.[1]
Where it fits in the process flow
The Besi 2100 FC hS supports flip chip package types that include FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and CSP-LED.[1]
Applications
What do the numbers mean?
Wafer handling2
Performance2
Dimensions & facilities3
Configuration & options9
- Flip chip capability[4]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the 2100 FC hS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 FC hS are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2100 FC hS are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2100 FC hS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2100 FC hS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2100 FC hS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]2100 FC hS — Besi | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]semiconductor.directory — semiconductor.directorysemiconductor.directory
- [4]Inventory photo
Last updated Oct 4, 2026.
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