Waferpedia

ASM

Eagle 10

DepositionASM Eagle 10 family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

ASMEagle 10
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What it is

The ASM Eagle 10 is a plasma-enhanced chemical vapor deposition system manufactured by ASM.[2]

How it works

General reference — not yet source-verified

PECVD systems introduce reactant gases into a vacuum chamber where a radio-frequency (RF) or microwave plasma is sustained. The plasma breaks down the gases into reactive radicals that adsorb onto the wafer surface and react to form a solid film. The ASM Eagle 10 operates on this principle to deposit dielectric layers such as silicon dioxide and silicon nitride. The plasma energy enables deposition at lower temperatures, reducing thermal stress on the wafer.

What do the numbers mean?

Gas & chemistry1

Tool type
Plasma CVD (Chemical Vapor Deposition)[2]
Accurate?

Configuration & options3

OEM
ASM[1]
Accurate?
Model
Eagle 10[1]
Accurate?
Vintage
2000[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Tool typePlasma CVD (Chemical Vapor Deposition)[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What kinds of materials are deposited by this class of machine?General reference — not yet source-verified

Machines of this class can deposit films chosen for electrical, protective, optical, or barrier functions, depending on the process chemistry.

Why is process control important in deposition equipment?General reference — not yet source-verified

Because film quality depends on stable control of chamber conditions, material delivery, and surface reaction during the process.

Not publicly documented

The following facts about the Eagle 10 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Eagle 10 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Eagle 10 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Eagle 10 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Eagle 10 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Eagle 10 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
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Last updated Oct 9, 2026.

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