ASM

ADL 838 LG 2

Packaging & Bonding Wafer System:ASM ADL 838 family

Research Quality: 30% complete

The ASM ADL 838 LG 2 is a die bonder. The ASM ADL 838 LG 2 uses clamp ring or wafer expander input. The ASM ADL 838 LG 2 supports 6-inch wafers on clamp ring and 8-inch wafers on expander.^[1]^[2]

ADL 838 LG 2 — Inventory photo — Fig. 01ADL 838 LG 2Inventory photo^[1]

Wafer size

Wafer System:

Power

100 - 240 VAC (single phase)^[1]

What is it?

The ASM ADL 838 LG 2 is a die bonder with clamp ring or wafer expander input and support for 6-inch wafers on clamp ring or 8-inch wafers on expander.

What do the numbers mean?

Power & electrical2

Voltage: 100 - 240 VAC (single phase)^[1]
Frequency: 50/60 Hz^[1]

Wafer handling8

Wafer size: Wafer System:^[1]
Input type: clamp ring / wafer expander^[1]
Wafer size: 6" on clamp ring / 8" on expander^[1]; Substrate Size:^[1]
Wafer system: ASM ADL 838 family^[2]
Substrate length: 2.36" - 11.81"^[1]
Substrate width: 2.36" - 3.94"^[1]
Substrate thickness: 5 - 118 mil^[1]

Dimensions & facilities6

Facilities Required:^[1]
Magazine width: 2.36" - 4.33"^[1]
Magazine height: 2.68" - 7.48"^[1]
Width: 2.36" - 3.94"^[1]
Width: 2.36" - 4.33"^[1]
Height: 2.68" - 7.48"^[1]

Configuration & options26

0 hours ran^[1]; Pattern Recognition System:^[1]
PR system: full color, 256 grey levels^[1]
Full-load consumption: ~ 1,500 W^[1]; System Capability:^[1]
UPH: 14,000+ (ASMPT in-house test)^[1]; Material Handling Capability:^[1]
Die Size: 6 x 6 mil - 80 x 80 mil^[1]; (0.15 x 0.15mm - 2.03 x 2.03mm)^[1]; Without up-look inspection 6 x 6 mil - 400 x 400 mil^[1]; (0.15 x 0.15 mm - 10.16 x 10.16 mm)^[1]
Flip Chip Handling: standard^[1]
Length: 2.36" - 11.81"^[1]
OEM: ASM^[1]
Model: ADL 838 LG 2^[1]
Category: Packaging & Bonding^[2]
Tool type: Die bonder^[1]
Pattern recognition system: full color, 256 grey levels^[1]
Die size: 6 x 6 mil - 80 x 80 mil (0.15 x 0.15mm - 2.03 x 2.03mm)^[1]
Die size without up-look inspection: 6 x 6 mil - 400 x 400 mil (0.15 x 0.15 mm - 10.16 x 10.16 mm)^[1]
Magazine length: 2.36" - 12.20"^[1]
Bond force: Programmable (30 - 300g)^[1]
Bond head: High force bond head^[1]
Condition: 0 hours ran^[1]
Thickness: 5 - 118 mil^[1]
Length: 2.36" - 12.20"^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Voltage100 - 240 VAC (single phase)^[1]
Frequency50/60 Hz^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the ADL 838 LG 2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ADL 838 LG 2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ADL 838 LG 2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ADL 838 LG 2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ADL 838 LG 2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ADL 838 LG 2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report