ASM
AB 530 Wedge
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM AB 530 Wedge is a wedge wire bonder designed for semiconductor packaging and bonding processes.[1][2]
What it is
How it works
General reference — not yet source-verifiedWedge bonders use ultrasonic energy to create interconnections between a semiconductor die and its package or substrate. A wire is fed through a bonding tool, and the tool presses the wire against a bond pad while ultrasonic vibrations are applied, forming a metallurgical bond. The wedge tool then manipulates the wire to form a controlled loop before making the second bond at the target location. The process does not require heat for most applications, making it suitable for temperature-sensitive devices.
Applications
General reference — not yet source-verifiedWedge bonders are primarily used for attaching fine aluminum or gold wire in semiconductor packages. Common applications include hybrid circuits, microwave modules, and high-reliability military and aerospace assemblies. The technique is also employed in multi-chip modules and sensor packaging where fine-pitch bonding is required.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the AB 530 Wedge are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the AB 530 Wedge are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AB 530 Wedge are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AB 530 Wedge are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AB 530 Wedge are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AB 530 Wedge are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]AB 530 Wedge — ASM | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 7, 2026.
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