Applied Materials
P5000
The Applied Materials P5000 is a PECVD system designed for dielectric deposition. The Applied Materials P5000 has two dedicated chambers: one for TEOS-based silicon dioxide and one for silane/ammonia-based silicon nitride. The Applied Materials P5000 can process wafers up to 8 inches in diameter and operates at nominal temperature around 400°C.[1]
Plate 01AMAT P5000 PECVD Nitride 2 Chambers
Gerard Oliver DunneWatch on YouTube
Wafer size
150mm
Gas delivery
TEOS/O2[1]
What it is
How it works
Where it fits in the process flow
Both chambers can process wafers up to 8 inches in diameter and deposit films multiple microns thick.[1]
Applications
The tool is used for dielectric PECVD, silicon dioxide deposition with TEOS/O2 chemistry, and silicon nitride deposition with SiH4/NH3 capability.[1]
- Silicon dioxide deposition
- Silicon nitride deposition
What do the numbers mean?
Wafer handling2
Gas & chemistry4
Configuration & options8
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What materials can the Applied Materials P5000 PECVD deposit?
It can deposit silicon dioxide and silicon nitrides.[1]
What wafer size does the tool handle?
Both chambers can process wafers up to 8 inches.[1]
What is the operating temperature?
The nominal operating temperature is about 400 C.[1]
How many chambers does the system have?
It has two dedicated chambers for dielectric PECVD.[1]
Not publicly documented
The following facts about the P5000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P5000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the P5000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the P5000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the P5000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the P5000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]cmdis.rpi.edu — cmdis.rpi.educmdis.rpi.edu
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]Inventory photo
- [9]Facility Updates | MIT.nano — mitnano.mit.edumitnano.mit.edu
Last updated Sep 21, 2026.
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