Angstrom Engineering
EvoVac
The Angstrom EvoVac Electron Beam Evaporator is a load locked PVD tool which evaporates high melting point materials, such as refractory metals and ceramics, using an electron beam. The EvoVac provides multiple sources of flexibility in its deposition system including resistive thermal evaporation, ion assisted and sputter deposition, as well as principal electron beam evaporation. The EvoVac features a 6 pocket E-beam source, 15 cc crucibles, and a programmable 2-axis sweep controller.[1]
How it works
The EvoVac uses a six-pocket electron beam source with fifteen cubic centimeter crucibles. A programmable two-axis sweep controller directs the beam. The system includes a Kaufman gridless ion source for ion beam assisted deposition, in-situ substrate pre-cleaning, low energy ion beam etching, and surface modification. Advanced multi-layer deposition control enables precise layer monitoring. The tool also features a pneumatic airline filter and long source-to-substrate distances.[1]
Applications
Applications include electronic and optical semiconductor films, wear resistant and thermal barrier coatings, and hard coatings for tools. The system is also used for depositing refractory metals and ceramics.[1]
- Electronic and optical semiconductor films
- Wear resistant and thermal barrier coatings
- Hard coatings for tools
What do the numbers mean?
Wafer handling6
- In-situ functions
- In-situ substrate pre-cleaning, low energy ion beam etching, and surface modification[1]
Optics & imaging1
Performance1
Control & software4
Configuration & options11
- Additional deposition modes
- Resistive thermal evaporation, ion assisted deposition, and sputter deposition[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the EvoVac are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EvoVac are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EvoVac are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EvoVac are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EvoVac are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EvoVac is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]pnf.uchicago.edu — pnf.uchicago.edupnf.uchicago.edu
- [2]Resource Scheduler & Rates | Colorado Shared Instrumentation in Nanofabrication and Characterization (COSINC) | Universi — colorado.educolorado.edu
Last updated Sep 21, 2026.
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