Accretech
UF 2000
How it works
The UF 2000 uses a precision Z/θ stage mechanism to align the wafer with the probe card and bring the probes into contact with each die. A wafer is loaded from a cassette, pre-aligned, and then transported to the chuck using dual robotic arms. The system includes a capacitive non-contact displacement sensor and dual X/Y moiré scales for accurate positioning.[4][5]
The prober achieves a placement precision of ±1.5 µm. The environment temperature is precisely controllable, and the chuck can be configured as a low-temperature or hot-temperature chuck, allowing testing from -40 °C to +150 °C. An optional ARTS-HS chiller unit provides rapid thermal cycling. The user interface includes a color LCD control panel with touch-screen switches.[4][5]
Applications
Additional application-specific options include a dual-lifter for increased productivity, a multi-site parallel probing option (up to 128 DUTs), and a probe-mark inspection option. The system can be configured with a cleaning unit for probe needles and a wafer ID recognition system for tracking.[1][5]
What do the numbers mean?
Power & electrical4
Wafer handling5
Performance1
Control & software2
Configuration & options10
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the placement precision of the UF 2000?
The UF 2000 achieves a placement precision of ±1.5 µm.[4]
What type of power supply does the UF 2000 require?
The UF 2000 operates on 220 VAC single-phase power at 50/60 Hz.[1]
What types of devices can be tested on the UF 2000?
The UF 2000 is suitable for testing discrete devices, power devices, logic devices, and MEMS.[6]
Not publicly documented
The following facts about the UF 2000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 2000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UF 2000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 2000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UF 2000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UF 2000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]accretech.eu — accretech.euaccretech.eu
- [5]semistarcorp.com — semistarcorp.comsemistarcorp.com
- [6]UF2000｜ Probing Machines | ACCRETECH - TOKYO SEIMITSU — accretech.comaccretech.com
Last updated Oct 2, 2026.
