Koh Young KY 8030 3D

Models in this family

1. 

   KY 8030 3D

   The Koh Young KY 8030 is a line of True 3D solder paste inspection (SPI) systems for printed circuit board manufacturing.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   KY8030-2	—	—	The most widely installed configuration; inspects from 11.1 to 59.5 cm²/sec to a paste height of 450 microns, with resolutions of 10, 15, 20 or 25 microns.	kohyoungamerica.com[1]
   KY8030-3	—	—	Roughly twice the throughput of the KY8030-2, reaching 81.85 cm²/sec at 8 megapixel and 20 microns, to a 400 micron inspection height; also inspects conductive glue and sinter paste.	kohyoungamerica.com[1]
   KY8030 USX	—	—	Extended-length configuration of the KY8030-3, for assemblies up to 1,300 millimetres in a single pass.	kohyoungamerica.com[1]

Sources