ASM AD 838

Models in this family

1. 

   AD 838

   The ASM AD 838 is an 8-inch-wafer die bonder with epoxy dispensing and no stack input, operating on single-phase 220 Vac at 50/60 Hz.

2. 

   AD 838 L

   The ASM AD 838 L is a die bonder for semiconductor packaging applications.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   AD 838 L G 2	—	2020	Listed as a die bonder for 6-inch and 8-inch wafers; one of the two archerfish dispensing modules does not work; gripper needs to be leveled.	Equipment inventory listing[1]
   ASM AD 838 L G 2	—	2020	Supports 6-inch and 8-inch wafers; includes two archerfish dispensing modules.	Equipment inventory listing[1]

3. 

   AD 838 L Dual Epoxy

   ASM AD 838 L Dual Epoxy System is a wafer-table epoxy system for 8-inch wafers with an automatic wafer loader, needle ejector, and input/output magazine handlers.

4. 

   AD 838 L Epoxy

   The ASM AD 838 L Epoxy is a die bonder with an epoxy dispenser.

5. 

   AD 838 L G 2

   ASM AD 838 L G 2 is a die bonder with support for 6-inch and 8-inch wafer sizes.

Sources