Tool family
Applied Materials Endura 5500 is a PVD (Physical Vapor Deposition) system for 8-inch wafers.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Liner/Barrier | — | — | Described as an 8-inch Endura 5500 PVD configuration for liner/barrier use. | Equipment inventory listing[1] |
| Front-End Metallization | — | — | Described as an 8-inch Endura 5500 PVD configuration for front-end metallization. | Equipment inventory listing[2] |
| Aluminum Interconnect | — | — | Described as an 8-inch Endura 5500 PVD configuration for aluminum interconnect. | Equipment inventory listing[3] |
The Applied Materials Endura 5500 HP is a sputtering system in the deposition category.
The Applied Materials Endura 5500 IMP is a deposition tool configured as a PVD system for 8-inch wafers.
Applied Materials Endura 5500 Metal Sputterer is a semiconductor deposition tool described as a metal sputterer with 6-inch and 200mm wafer-size references in the provided sources.
Applied Materials Endura 5500 TxZ is a PVD sputter (physical vapor deposition) system with multiple chambers, including IMP and TxZ chambers.
Applied Materials Endura 5500 is a PVD (Physical Vapor Deposition) system for 8-inch wafers.
The Applied Materials Endura 5500 HP is a sputtering system in the deposition category.
The Applied Materials Endura 5500 IMP is a deposition tool configured as a PVD system for 8-inch wafers.
Applied Materials Endura 5500 Metal Sputterer is a semiconductor deposition tool described as a metal sputterer with 6-inch and 200mm wafer-size references in the provided sources.
Applied Materials Endura 5500 TxZ is a PVD sputter (physical vapor deposition) system with multiple chambers, including IMP and TxZ chambers.