Comparison ledger
West Bond 10490, Yamaha I Cube II YHP 2 Flip Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10490West Bond | |
|---|---|---|
| OEM | West Bond | Yamaha |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | West Bond 10490 | Yamaha I Cube II YHP 2 Flip Chip |
| Specifications | ||
| Manufacturer | West Bond[1] | — |
| Model | 10490[1] | — |
| Description | Convertible bonder, wedge to ball[2] | — |
| Tool type | Convertible bonder[3] | — |
| Bonding modes | Wedge bonding and ball bonding[3] | — |
| Use | Wire bonding[3] | — |
| Phase | — | 3 Phase[4] |
| Rating | — | 4.4VA[4] |
| Ave. Power Consumption | — | 0.7kW[4] |
| Head Type | — | 4 M[4] |
| Accessories | — | 4 Nozzles each (61, 6 A)[4] |
| Configuration | — | Loader and Unloader not included[4] |
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