Comparison ledger
View Engineering 1101, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1101View Engineering | 10490West Bond |
|---|---|---|
| OEM | View Engineering | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | 1982 | — |
| Production run | 1982– | — |
| Lifecycle | Legacy | — |
| Lifecycle milestones | 1982 Introduction | — |
| Control system | — | — |
| Generation | 2nd generation | — |
| Family | View Engineering 1101 | West Bond 10490 |
| Specifications | ||
| Generation | 2nd generation[1] | — |
| Image type | binary image[1] | — |
| System type | pattern recognition system[1] | — |
| Application | automated wirebonding machines and wafer probers[1] | — |
| Introduction year | 1982[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 10490[2] |
| Description | — | Convertible bonder, wedge to ball[3] |
| Tool type | — | Convertible bonder[4] |
| Bonding modes | — | Wedge bonding and ball bonding[4] |
| Use | — | Wire bonding[4] |
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