Waferpedia

Comparison ledger

0332 F 9453 302 DiffusionversusPB12-2P-CP

Varian 0332 F 9453 302 Diffusion, YES PB12-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMVarianYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size—12 in.
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyVarian 0332 F 9453 302 DiffusionYES PB12-2P-CP
Cited variants—
  • YES PB12-2P-CP[1]
Specifications
Asset Number142841[2]—
Last Confirm DateOctober 14, 2025[3]—
Model—PB12-2P-CP[1]
Wafer capacity—2 cassettes of 12 in. wafers[1]
Chamber configuration—single compartment[1]
Chamber size—14.5 in. x 21 in. x 27 in. deep chamber[1]
Controller—CTC Controller with Color Touchscreen[1]
Included package—Cooling Package[1]
Chamber dimensions (OEM source)—14.5 in. x 21 in. x 27 in. deep chamber[1]
Chamber dimensions (secondary source)—21 in. barrel x 40.97 in. deep[4]
Maximum temperature—450 °C[1]
Recipe capability—8 recipes with up to 16 ramps and dwells each[1]
N2 flow rate—1 SCFM[4]
Chamber cleanliness—Class One[4]
Electrical requirements—208 V, 3 phase, 30 A, 50/60 Hz[4]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]Equipment inventory listing
  3. [3]fab-spares.comfab-spares.com
  4. [4]semistarcorp.comsemistarcorp.com