Waferpedia

Comparison ledger

Automegasamdri 915Bversus1000FP

Tousimis Automegasamdri 915B, YES 1000FP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMTousimisYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTousimis Automegasamdri 915BYES 1000FP
Specifications
Equipment typeCritical point dryer[1]—
Process modeSamples are dried at the CO2 supercritical point[1]—
Starting mediumUltra pure ethanol[1]—
Chamber pressure before opening0 psi[1]—
Operation modes mentionedAuto Mode, HEAT, BLEED, VENT, COOL[1]—
TypeAutomated critical point drying system[2]—
Substrate sizeUp to 150 mm wafer[2]—
Manufacturer locationRockville, MD, United States[3]—
UseDrying freshly released structures with minimum sticking issues[1]—
Drying mediumCO2 at the supercritical point[1]—
System type—Plasma cleaning system[4]
Line—R-Series Plasma Cleaning Systems (Glen Technologies)[4]
Model—Glen/YES 1000FP[4]
Designed use—Designed to accept a range of shelf sizes[4]
Application focus—Changing needs of the flat panel industry[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.ch
  2. [2]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  3. [3]frontiersin.orgfrontiersin.org
  4. [4]web.archive.orgweb.archive.org