Comparison ledger
SUSS MicroTec CB 200 Bonding, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | CB 200 BondingSUSS MicroTec | 10490West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec CB 200 Bonding | West Bond 10490 |
| Specifications | ||
| Configuration | High Pressure[1] | — |
| OEM | SUSS MicroTec[1] | — |
| Model | CB 200 Bonding[1] | 10490[3] |
| Category | Packaging & Bonding[1] | — |
| Wafer size | 8 inch[2] | — |
| Manufacturer | — | West Bond[3] |
| Description | — | Convertible bonder, wedge to ball[4] |
| Tool type | — | Convertible bonder[5] |
| Bonding modes | — | Wedge bonding and ball bonding[5] |
| Use | — | Wire bonding[5] |
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