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Comparison ledger

1070versusNextest Magnum II EV Final

Signatone 1070, Teradyne Nextest Magnum II EV Final, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1070Signatone
OEMSignatoneTeradyne
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySignatone 1070Teradyne Nextest Magnum
Specifications
MakeSignatone[1]—
Model1070[1]—
Configuration—Self- contained, low-power engineering test system[2]
Equipment type—Tester[2]
Description—Self-contained, low-power engineering test system[2]
Digital I/O—Up to 128 digital I/O pins[2]
Option board—DPS, VRC, or MPAC option board[2]
Air supply—Internal air compressor air to operate the load board latch mechanics[2]
Power—Standard 110 VAC power (220 VAC Europe)[2]
DPS board—4 DPS Board[2]
Channel count—128 channel (IO)[2]
Connectivity—LAN port and GPIB available[2]
Site assembly—Only one site assembly board in these EVs[2]
Prober connection—MVT tools connected a P12XL TEL Prober[2]
PC OS—Windows Server 2019 Standard[2]
Tester software—Nextest Version H8.5.2.1[2]
Loader board note—No test card connect by Loader Board[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing