Comparison ledger
OAI 200, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200OAI | 1000 FamilyUltratech |
|---|---|---|
| OEM | OAI | Ultratech |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | OAI 200 | Ultratech 1000 Family |
| Specifications | ||
| OEM | OAI[1] | — |
| Model | 200[1] | — |
| Tool owner | Brian Baker[1] | — |
| Serial number | 1213[1] | — |
| Location | Bay B[2] | — |
| Substrate size accommodation | up to 6"x6"[3] | — |
| Mask size accommodation | 2"x2" to 7"x7"[3] | — |
| Maximum mask size (datasheet) | up to 9"x9"[4] | — |
| Alignment precision | 1 micron[5] | — |
| Vacuum Chuck X, Y travel | ±0.47" (12mm)[3] | — |
| Vacuum Chuck Z travel | ±0.12" (3mm)[3] | — |
| Vacuum Chuck rotation | ±7°[3] | — |
| Substrate Stage X, Y travel (datasheet) | ±10mm[4] | — |
| Z travel (datasheet) | 1500 microns[4] | — |
| Rotation (datasheet) | ±3.5°[4] | — |
| Lamp power range | 200W to 2000W[5] | — |
| UV wavelength range | Near or Deep UV (220nm to 436nm)[3] | — |
| Exposure intensity control | ±2% of desired intensity[5] | — |
| Timer range | 0-1000 seconds in 1 second intervals[3] | — |
| Dimensions (width) | 31 inches[3] | — |
| Dimensions (height) | 37 inches (datasheet: 37")[4] | — |
| Weight | 250 lbs[4] | — |
| Tool type | — | Photolithography step-and-repeat 1X stepper[6] |
| Optical design | — | Wynne Dyson[6] |
| Magnification | — | 1X[6] |
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