Comparison ledger
Laurell H6-8, Laurell WS-650-8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | H6-8Laurell | WS-650-8Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Laurell H6-8 | Laurell WS-650-8 |
| Cited variants |
|
|
| Specifications | ||
| Maximum rotational speed | 12,000 RPM (based on a 100mm silicon wafer)[1] | 12,000 RPM[2] |
| Substrate capacity | Up to 7" × 7" (178mm × 178mm) substrates[1] | Up to 7 in x 7 in (178 mm x 178 mm) substrates[2] |
| Wafer capacity | Up to 200mm wafers[1] | Up to 200 mm wafers[2] |
| Series | 650-series HL coater system[1] | 650-series[2] |
| Power | 95 to 240VAC, 47/63HZ, ~300 Watts[1] | 95 to 240VAC, 47/63HZ, ~300 Watts[2] |
| N2 process/seal purge | 60–70 PSIG (4–5 bar) of Nitrogen/ CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour)[1] | — |
| Vacuum | 25–28 inches (~635–711mm) Hg; flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[1] | — |
| Typical process use | Solvent, Base or Acid-based processing[3] | — |
| System type | Spin coater[3] | — |
| Standard chuck | Vacuum chuck[3] | — |
| Standard adapter | Fragment adapter[3] | — |
| Control software | Laurell Touch process control software; Spin 3000 PC software[3] | — |
| Vacuum requirement | 25 to 28 inches Hg; 4.5 SCFM at 0 inches Hg[3] | — |
| Nitrogen/CDA purge pressure | 60 to 70 PSIG[3] | — |
| Product type | — | Spin coater[2] |
| Basis for max speed rating | — | Based on a 100 mm silicon wafer[2] |
| Process controller | — | 650-series process controller with robust microprocessor and accompanying PC software[2] |
| Power requirement | — | 95 to 240 VAC, 47/63 Hz, approximately 300 W[2] |
| Nitrogen/CDA process/seal purge | — | 60 to 70 PSIG (4 to 5 bar)[2] |
| Vacuum suggestion | — | 25 to 28 inches Hg; 4.5 SCFM at 0 inches Hg[2] |
| Applications | — | Coating, etching, developing, rinsing-drying, and cleaning[2] |
| Model | — | WS-650-8B[2] |
| Category | — | Spin coater[2] |
| Speed reference condition | — | Based on a 100mm silicon wafer[2] |
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