Waferpedia

Comparison ledger

EDC-HL-15versusWS-650

Laurell EDC-HL-15, Laurell WS-650, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
EDC-HL-15Laurell
WS-650Laurell
OEMLaurellLaurell
CategorySpin coaterSpin coater
Wafer size300mm150mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation650-series—
FamilyLaurell EDC-HL-15Laurell WS-650
Cited variants
  • EDC-HL-15 B650-series[1]
  • EDC-HL-23B650-series[1]
  • EDC-HL-8B650-series[1]
—
Specifications
ModelEDC-HL-15 B[1]Laurell WS-650[3]
Series650-series EDC system[1]—
Wafer/substrate capacityUp to ø 300 mm wafers and 9" × 9" (229 mm × 229 mm) substrates[1]—
Maximum speed capability12,000 RPM with vacuum hold-down[1]—
Recommended speed3,000 RPM[1]—
Recommended chuck typeNon-vacuum chucks[1]—
Power95 to 240 VAC, 47/63 Hz, ~300 Watts[1]—
CategorySpin coater[1]—
Wafer capacityUp to 300mm wafers[1]—
Substrate capacity9 in × 9 in (229mm × 229mm) substrates[1]—
Equipment type—Cleanroom Instrumentation; Thin Film Fabrication[2]
Use—Should be used only for spincoating of photoresists[2]
Speed range—100-12,000 RPM[2]
Substrate size—Up to 150 mm round substrates and 125 mm square substrates[2]
Substrate thickness—0.1 to 1 mm[2]
Adapter—Wafer Fragment Adapter for 10–50 mm substrate fragments[2]
Location—FNT 4.106[2]
Installed location—Photolithography hood[2]
Type—Spin coater[3]
Purpose—Coating photoresist on samples of various sizes[3]
Wafer size support—50 mm through 150 mm substrates[3]
Controller speed range—100-8000 rpm[3]
Speed resolution—0.5 rpm[3]
Program capacity—Up to twenty 51-step programs[3]
Vacuum chuck—1.75 inch natural propylene vacuum chuck[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]tmi.utexas.edutmi.utexas.edu
  3. [3]aggiefab.tamu.eduaggiefab.tamu.edu