Waferpedia

Comparison ledger

15 Lapperversus7 AF

Lapmaster 15 Lapper, Strasbaugh 7 AF, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
7 AFStrasbaugh
OEMLapmasterStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Strasbaugh 7 AF
Specifications
Number Of Conditioning RingsUp to 3[1]—
Ring IDUp to 5.5″[1]—
Plate Diameter – Outside15″[1]—
Plate Diameter – Inside3 1/2″[1]—
Standard RPM60[1]—
Drive Motor1/2 HP[1]—
Electrics110V / 1Ph / 60Hz[1]—
Dimensions – Approximate26″(L-R) x 21″(F-B) x 22″(H)[1]—
ConfigurationEquipped with:[1]—
Equipped with: 15″ Cast Iron PlateIncluded[1]—
Equipped with: (3) Yoke/Roller Bearing AssembliesIncluded[1]—
Equipped with: (3) Conditioning RingsIncluded[1]—
Equipped with: (3) Hold DownsIncluded[1]—
Equipped with: 30 Minute TimerIncluded[1]—
Phase—3 Phase[2]
Frequency—60 Hz[2]
OEM—Strasbaugh[3]
Model—7 AF[3]
Tool type—CMP (Chemical Mechanical Polisher)[3]
Electrical—3 Phase, 60 Hz[2]
Wafer size—200 mm[4]
Tapeless backgrinding support—Yes[4]
Compatible wafer types—Bumped and non-bumped wafers[4]
Power supply—3 Phase, 60 Hz[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]web.archive.orgweb.archive.org