Waferpedia

Comparison ledger

15versusMWS 610 SD

Lapmaster 15, Takatori MWS 610 SD, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
MWS 610 SDTakatori
OEMLapmasterTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Takatori MWS 610
Specifications
Input Power110 Vac[1]—
Plate Diameter15 inches (381 mm)[2]—
Number of Conditioning Rings3[2]—
Ring ID5.5 inches (140 mm)[2]—
Standard RPM60[2]—
RPM Range (Variable Speed Drive)0-60[2]—
Drive Motor - Lapper0.5 HP (0.37 kW)[2]—
Drive Motor - Polisher0.75 HP (0.56 kW)[2]—
Length25 inches (635 mm)[2]—
Width20 inches (508 mm)[2]—
Height24 inches (610 mm)[2]—
Estimated Shipping Weight285 lbs (129.3 kg)[2]—
Operating Hours—35076[3]
Configuration—Slurry supply tank with pump and agitator: 24 gal[3]
High rocking angle—± 3°[3]
Slurry supply tank capacity—24 gallons[3]
Rocking angle—±3°[3]
Vintage year—2017[3]
Slurry temperature controller—Present[3]
Slurry flow meter control system—Present[3]
Spindle axis temperature controller—Present[3]
Disposable reel adapter—Present[3]
Load cell electronic control—Present[3]
Electric control cabinet—Present[5]
Power transformer—Present[5]
Rocking bearing system—Present[5]
Ball screw system for work table—Present[5]
Vintage—2017[3]
Machine type—Wire saw[3]
Slurry supply tank—24 gal with pump and agitator[3]
HDD—Included, completely wiped, without software for operation[3]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]inventory listing
  8. [8]inventory listing