Waferpedia

Comparison ledger

12 Lapperversus1500

Lapmaster 12 Lapper, PR Hoffman 1500, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
1500PR Hoffman
OEMLapmasterPR Hoffman
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—PR Hoffman 1500
Specifications
Outside plate diameter12 inches[1]—
Lapping Speed Range0 to 60 rpm[2]—
Wafer Size Compatibility4 inches or smaller[1]—
Input Voltage110 V[1]—
Frequency60 Hz[1]—
Phase1[1]—
Number of Rings3[1]—
Number of Weights3[1]—
Includes Slurry SystemYes[1]—
Includes TimerYes[1]—
Model—85T[3]
Type—Double-sided planetary lapping / polishing machine[3]
Diameter—19 inch[3]
Motor—1.5 horsepower variable speed DC motor with controller[3]
Controller input—208/230V, 50/60 Hz[3]
Carrier—85 tooth carrier[3]
Recommended part thickness minimum—0.010 inch [250 micron][3]
Recommended part diameter maximum—4-1/4 inch [108 mm] or smaller[3]
Maximum part circle—6.6 inch [168 mm][3]
Stainless steel hood—Standard on all PR-1 models[4]
Plate lifter—Standard on the 85 tooth model[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu
  3. [3]web.archive.orgweb.archive.org
  4. [4]web.archive.orgweb.archive.org