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Comparison ledger

12 Benchtop Lapping Polishingversus6 EC CMP Wafer

Lapmaster 12 Benchtop Lapping Polishing, Strasbaugh 6 EC CMP Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
6 EC CMP WaferStrasbaugh
OEMLapmasterStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 12 Benchtop Lapping PolishingStrasbaugh 6 EC CMP Wafer
Specifications
MakeLapmaster[1]Strasbaugh[6]
Model12[1]6 EC CMP[6]
CategoryCMP[2]—
Type/ApplicationSingle sided[3]—
Plate diameter12 in[3]—
No. of conditioning rings3[4]—
ConfigurationRing lapper[4]—
BaseRigid, lightweight, cast aluminum base[4]—
Standard RPM60 RPM[4]—
RPM range with variable speed drive0-60[4]—
Drive motor - lapper0.5 HP[4]—
Drive motor - polisher0.75 HP[4]—
Length25 in[4]—
Width18 in[4]—
Height24 in[4]—
Estimated shipping weight240 lbs[4]—
Approximate weight135 lbs / 61 kg[5]—
Approximate dimensions24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[5]—
Electrical systemVarious voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[5]—
Motor1/3 hp / 0.25 kW motor with gear reducer[5]—
Abrasive feed systemDesigned for water or oil based lapping slurries[5]—
Automatic cycle timerAutomatic digital cycle timer[5]—
Ring configurationRing lapper[4]—
Ring ID4.25 inches[4]—
System type—CMP Wafer Polisher[6]
System description—Economical tool for CMP research, failure analysis, and low-volume production[7]
Operation—Semi-automatic[7]
GUI—Color, touch-screen GUI[7]
Table and spindle motors—Closed-loop table and spindle RPM motors[7]
Pad conditioning—Programmable pad conditioning[7]
Programmable control zones—20 zones[7]
Programmable control parameters—Dwell time, down force, and RPM[7]
Pad conditioning media—Diamond plated disk or nylon brush[7]
Option—ViPRR carriers[7]
Asset #—73620[6]
Operating mode—semi-automatic[7]
User interface—color, touch-screen GUI[7]
Process control zones—20 zones of programmable control[7]
Facility utility requirements—DI Water: 30 psi minimum, 1.5 GPM flow rate; Vacuum: 25" HG; Air: 100 psi, 5 SCFM; Electrical: 208 or 230 VAC, 3 phase, 60 Hz, 20 AMPS with conditioner, 30 AMPS; Exhaust: approx. 100 CFM[7]
Pad conditioning tools—diamond plated disk or nylon brush[7]
Options—ViPRR carriers[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]lapmaster-wolters.comlapmaster-wolters.com
  4. [4]catalog.lapmaster.comcatalog.lapmaster.com
  5. [5]lapmaster-wolters.comlapmaster-wolters.com
  6. [6]Equipment inventory listing
  7. [7]s3-alliance.coms3-alliance.com