Waferpedia

Comparison ledger

782-6versus15

Kulicke & Soffa 782-6, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
782-6Kulicke & Soffa
15Lapmaster
OEMKulicke & SoffaLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size6"—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKulicke & Soffa 782-6Lapmaster 15
Specifications
Maximum wafer sizeup to 6" wafers[1]—
Maximum wafer thickness800 µm thick[1]—
Materials dicedSi, Glass, Quartz, SiC, Sapphire, LiNbO3[1]—
Kerf widthdown to 50 µm (blade dependent)[1]—
Blade cooling and rinsingDI water[1]—
CategoryDicing & Grinding[2]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org