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OP 7341 XP Film Thickness Measurementversus1000 Family

KLA OP 7341 XP Film Thickness Measurement, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1000 FamilyUltratech
OEMKLAUltratech
CategoryLithographyLithography
Wafer size25 wafer load ports (Asyst) with robot transfer (2 paddies)—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA OPUltratech 1000 Family
Specifications
ConfigurationCD (1D & 2D features) & film stack measurement[1]—
Wafer size25 wafer load ports (Asyst) with robot transfer (2 paddies)[1]—
SoftwareUNT 6.0[1]—
OEMKLA / Therma-wave[1]—
ModelOP 7341 XP[1]—
Measurement functionsCD (1D & 2D features) & film stack measurement[1]—
AlignmentPrealigner & full alignment using Vision Processing[1]—
ComputingExternal Server SuperGrendel for fast computation (168 cores)[1]—
Load ports25 wafer load ports (Asyst) with robot transfer (2 paddies)[1]—
EnvironmentIntegrated Mini-Environment[1]—
Measurement chamberSeparated optical table design[1]—
Motion isolationPneumatic floating system ensuring no vibration for both stage and optics tables[1]—
User interfacesTwo user interface (Front & Read)[1]—
CommunicationSECS / GEM full capability[1]—
Auto-focusIncluded[1]—
Tool type—Photolithography step-and-repeat 1X stepper[2]
Optical design—Wynne Dyson[2]
Magnification—1X[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]en.wikipedia.orgen.wikipedia.org