Waferpedia

Comparison ledger

NXT H Placementversus2014-09-11T12

Fuji NXT H Placement, Koh Young 2014-09-11T12, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2014-09-11T12Koh Young
OEMFujiKoh Young
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyFuji NXTKoh Young 2014-09-11T12
Specifications
ConfigurationH02 Head[1]—
Head typeH02 Head[1]—
Maximum chip size60mm x 60mm[1]—
Placement capabilitiesHigh density, low impact, semiconductor[2]—
Feeding methodsWafer and reel part placement, direct pickup from wafers[2]—
Drive systemLinear motor movement[2]—
Alignment systemHigh-resolution cameras[2]—
Cleanroom classClass 1000[2]—
User interface15-inch touchscreen panel[2]—
XY robot cleanroom capabilityCleanroom capable; HEPA filter option available[2]—
Semiconductor Solutions—Listed as one of the company’s business areas[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]smt.fuji.co.jpsmt.fuji.co.jp
  3. [3]web.archive.orgweb.archive.org