Comparison ledger
Disco Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DicingDisco | 15Lapmaster |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco Dicing | Lapmaster 15 |
| Cited variants |
| — |
| Specifications | ||
| Configuration | Parts Tool[2] | — |
| Substrate size | up to 8 inches[3] | — |
| Substrate thickness | up to 1.25 mm[3] | — |
| Spindle | 2” front-mount, air driven DC brushless, closed-loop control[3] | — |
| Y-axis | closed-loop linear encoder[3] | — |
| Height sensing | non-contact optical[3] | — |
| Pattern recognition | auto-focusing and programmable illumination[3] | — |
| Equipment type | Dicing saw[2] | — |
| Model | -[2] | — |
| Maximum substrate thickness | up to 1.25 mm[3] | — |
| Applications | dicing of silicon, bonded Si wafers, and all types of glasses[3] | — |
| Input Power | — | 110 Vac[4] |
| Plate Diameter | — | 15 inches (381 mm)[5] |
| Number of Conditioning Rings | — | 3[5] |
| Ring ID | — | 5.5 inches (140 mm)[5] |
| Standard RPM | — | 60[5] |
| RPM Range (Variable Speed Drive) | — | 0-60[5] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[5] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[5] |
| Length | — | 25 inches (635 mm)[5] |
| Width | — | 20 inches (508 mm)[5] |
| Height | — | 24 inches (610 mm)[5] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[5] |
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