Waferpedia

Comparison ledger

DFG 850 Backversus15

Disco DFG 850 Back, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFGLapmaster 15
Specifications
Power200-208 V, 50/60 Hz, 3 Phase[1]—
Spindle TypeAir Bearings[1]—
Maximum Spindle Speed7,000 RPM[1]—
External CoolingWater Cooled[1]—
ConfigurationDisco DVC 011 Vacuum Coolant Unit[1]—
Associated Coolant UnitDisco DVC 011 Vacuum Coolant Unit[1]—
Wafer Sizes8 inch[2]—
Vacuum Coolant UnitDisco DVC 011[1]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org