Comparison ledger
Disco 841 Back, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 841 BackDisco | 15Lapmaster |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 841 Back | Lapmaster 15 |
| Specifications | ||
| Wafer size range | 4 to 8 inches (100-200 mm)[1] | — |
| Grinding type | In-feed grinding with wafer rotation[1] | — |
| Number of spindles | 2[1] | — |
| Spindle speed range | 1000-7000 rpm[1] | — |
| Vertical stroke | 110 mm[1] | — |
| Chuck table type | Porous chuck table with vacuum chuck[1] | — |
| Grinding wheel diameter | 8 inches[1] | — |
| Cassette capacity | Two cassettes for loading/unloading[1] | — |
| Planarity accuracy (within wafer) | 0.0015 mm[1] | — |
| Compliance | EC CE marking and SEMI S2-93 (DFG841)[1] | — |
| Dimensions (W x D x H) | 1050 mm x 2150 mm x 1710 mm[1] | — |
| Electrical requirements | 200V, 3 Phase, 50/60 Hz[1] | — |
| CDA pressure | 0.5-0.8 MPa[1] | — |
| DI water pressure and flow | 0.2-0.3 MPa, 15 l/min or higher[1] | — |
| Input Power | — | 110 Vac[2] |
| Plate Diameter | — | 15 inches (381 mm)[3] |
| Number of Conditioning Rings | — | 3[3] |
| Ring ID | — | 5.5 inches (140 mm)[3] |
| Standard RPM | — | 60[3] |
| RPM Range (Variable Speed Drive) | — | 0-60[3] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[3] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[3] |
| Length | — | 25 inches (635 mm)[3] |
| Width | — | 20 inches (508 mm)[3] |
| Height | — | 24 inches (610 mm)[3] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[3] |
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