Comparison ledger
Disco 3220, Disco DFL 7361, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | DFL 7361Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | Integrated Wafer Cleaning System with Atomizing Nozzle |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DFL |
| Cited variants | — |
|
| Specifications | ||
| equipment type | dicing saw[3] | — |
| Workplace size | ø150 mm[4] | — |
| Spindle layout | Single[4] | — |
| Spindle output | 1.5 kW at 30,000 min-1[4] | — |
| Spindle max revolution speed | 40,000 min-1[4] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[4] | 0.1 - 1,000 mm/s[2] |
| Y-axis index step | 0.0001 mm[4] | — |
| Z-axis repeating accuracy | 0.001 mm[4] | — |
| Z-axis max blade size | ø58 mm[4] | — |
| Configuration | — | Type FX Laser Head[1] |
| Wafer size | — | Integrated Wafer Cleaning System with Atomizing Nozzle[1] |
| Max workpiece size | — | ø300 mm[2] |
| Processing mode | — | Fully automatic[2] |
| Y-axis positioning accuracy | — | 0.003 mm within 310 mm[2] |
| Dimensions (W x D x H) | — | 1,210 x 3,270 x 1,906 mm[2] |
| Weight | — | approx 2,570 kg[2] |
| Supported wafer size | — | 2" to 12"[1] |
| Laser head | — | Type FX[1] |
| Optics system | — | BSS-6[1] |
| Wafer cleaning system | — | Integrated with Atomizing Nozzle[1] |
| OEM | — | Disco[1] |
| Model | — | DFL 7361[1] |
| Category | — | Laser Saw[1] |
| Maximum workpiece size | — | ø300 mm[2] |
| Processing method | — | Fully automatic[2] |
| Dimensions (WxDxH) | — | 1,210 x 3,270 x 1,906 mm[2] |
| Chuck table | — | Chuck Table moving in X- and Y-direction; 12" and 8" Porous Chuck Table & Spinner Table[1] |
| User interface | — | Graphical User Interface with Touch Screen[1] |
| Vision system | — | High Resolution Image Processing System with Auto Focus[1] |
| Frame handling | — | Fully Automatic Frame Handling System[1] |
| Coating system | — | Independent Hogomax spin coating system[1] |
| Loading/unloading | — | Cassette Loading / Unloading[1] |
| Duct unit | — | Duct Unit (Internal Type)[1] |
| Power conditioning | — | Overseas Transformer Unit; Uninterruptible Power Supply[1] |
| Documentation | — | Operation & Troubleshooting Manual (English); Installation and 3-days Operation Training[1] |
| Ablation processing support | — | Supports ablation processing; corresponding to 300mm workpiece[2] |
| Laser Head Type | — | Type FX[1] |
| Chuck Table Movement | — | X and Y direction[1] |
| Image Processing | — | High Resolution Image Processing System with Auto Focus[1] |
| Spin Coating System | — | Independent Hogomax spin coating system[1] |
| Chuck Table Sizes | — | 12" and 8" Porous Chuck Table & Spinner Table[1] |
| Cassette Handling | — | Cassette Loading / Unloading[1] |
| Duct Unit | — | Internal Type[1] |
| Transformer | — | Overseas Transformer Unit[1] |
| Power Supply | — | Uninterruptible Power Supply[1] |
| X-Axis Feed Speed | — | 0.1 - 1,000 mm/s[2] |
| Y-Axis Positioning Accuracy | — | 0.003 mm or less per 310 mm[2] |
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