Comparison ledger
Disco 321, Disco Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | DicingDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco Dicing |
| Cited variants | — |
|
| Specifications | ||
| OEM | Disco[2] | — |
| Model | 321[2] | -[5] |
| Equipment type | Wafer Dicing Saw[2] | Dicing saw[5] |
| Facility context | Cleanroom Instrumentation[2] | — |
| Application area | Nano and Micro Fabrication[2] | — |
| Location | FNT 4.106[2] | — |
| Wafer Size | Up to 6 inches[3] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[4] | — |
| Spindle Power (alternate) | 1500 Watt spindle[3] | — |
| Non-Contact Setup | Non Contact Setup[4] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[4] | — |
| Broken Blade Detection | Broken Blade Detection[4] | — |
| Light Tower | Includes Light Tower[4] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[3] | — |
| Wafer size capability | Up to 6" wafers[4] | — |
| Chuck | 6-inch porous film frame chuck[3] | — |
| Spindle power | 1500-watt spindle[3] | — |
| Footprint | Small footprint[3] | — |
| Setup | Non-contact setup[4] | — |
| Blade break detection | Broken blade detection[4] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[4] | — |
| Configuration | — | Parts Tool[5] |
| Substrate size | — | up to 8 inches[6] |
| Substrate thickness | — | up to 1.25 mm[6] |
| Spindle | — | 2” front-mount, air driven DC brushless, closed-loop control[6] |
| Y-axis | — | closed-loop linear encoder[6] |
| Height sensing | — | non-contact optical[6] |
| Pattern recognition | — | auto-focusing and programmable illumination[6] |
| Maximum substrate thickness | — | up to 1.25 mm[6] |
| Applications | — | dicing of silicon, bonded Si wafers, and all types of glasses[6] |
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