Waferpedia

Comparison ledger

288versusMonumentum DL

DEK 288, Speedline Monumentum DL, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Assembly / SMT, null[1]
Side-by-side comparison of selected equipment models
Attribute
288DEK
Monumentum DLSpeedline
OEMDEKSpeedline
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDEK 288Speedline Monumentum DL
Specifications
Minimum board size50 x 38 mm (2 x 1.5 in.)[2]—
Maximum board size510 x 510 mm (20 x 20 in.)[2]—
Thickness range0.4 to 6.4 mm (0.016 to 2.5 in.)[2]—
Transport speed500 mm/second (19.5 in./second)[2]—
Alignment repeatability25 µm repeatability at 6 Sigma[2]—
Alignment accuracy25 µm print to pad at 3 Sigma[2]—
Cycle time5 seconds + process variables, including fiducial capture and alignment[2]—
Set-up timeLess than 5 minutes[2]—
Product changeover2 minutes (approx.)[2]—
Host communicationsGEM and SECS II[2]—
NetworkingWindows-compatible LAN card[2]—
Remote diagnosticsModem option[2]—
SPCOn board, serial, remote[2]—
ApprovalsCE, EC certificate of conformity (Safety and EMC), GS German trade union safety standard[2]—
Approximate weight1500 kg[2]—
Approximate dimensions1580 mm W x 1640 mm D x 1680 mm H (nominal)[2]—
Stencil frame compatibilityExternal dimensions between 550 mm sq. and 850 mm sq.[2]—
Screen adjustment X/Y range±10 mm, resolution 2.5 µm[2]—
Theta range±2.0°, resolution 0.001°[2]—
Printable area with clamps510 x 504 mm (20 x 19.8 in.)[2]—
Printable area with snuggers510 x 510 mm (20 x 20 in.)[2]—
Print stroke56 to 680 mm (2.2 to 28.8 in.)[2]—
Print speed2 to 300 mm/second (0.08 to 12 in./second)[2]—
Print pressure0.4 to 20 kg (1 to 44 lbs.) active during print[2]—
Print gap0 to 3.0 mm (0 to 0.1 in.)[2]—
PCB stencil separation speed0.1 to 20 mm/second (0.004 to 0.8 in./second)[2]—
Print modesPrint/flood double squeegee[2]—
Squeegee typesAccepts most materials and style blades[2]—
Paste systemOption to dispense, 1 kg and 500 g cartridge[2]—
Paste kneadProgrammable paste kneading action[2]—
Stencil cleaningProgrammable frequency and wipe combinations; dry, wet, vacuum options[2]—
Air service3.5-6 bar[2]—
Electrics110 V 32 amps, 220 V 16 amps[2]—
Temperature cooling unitCools printhead temperature within the range 17-30°C[2]—
Environmental control unitFull temperature and humidity control of printhead environment[2]—
Product bar-code readerDual Image identified board and product verification[2]—
Screen bar-code readerProduct screen verification[2]—
On-board SPC softwareWindows-based software package displaying fiducial offsets, board stretch, front and rear squeegee pressure, print speed, separation speed, temperature and relative humidity; switchable between MMI and QC CALC[2]—
Fiducial size0.5 to 3 mm (0.02 to 0.1 in.)[2]—
Fiducial method2 and 3 fiducial option[2]—
Align calibrationFully automatic calibration[2]—
Camera systemOn-the-move telecentric XY camera with simultaneous look at stencil and board[2]—
Stencil inspectionBlocked apertures and smearing on underside of stencil triggers under-stencil cleaner[2]—
Board inspectionPaste alignment to pad, bridging, paste area, triggers paste dispense[2]—
Board size (min/max)50 x 38 mm (2 x 1.5 in.) up to 510 x 510 mm (20 x 20 in.)[2]—
Board thickness range0.4 to 6.4 mm (0.016 to 2.5 in.)[2]—
Cycle time (incl. fiducial capture & alignment)5 seconds + process variables[2]—
Print speed range2 to 300 mm/second (0.08 to 12 in./second)[2]—
Print pressure range0.4 to 20 kg (1 to 44 lbs.) active during print[2]—
Stencil frame size compatibilityframes with external dimensions between 550 mm (21.6 in.) sq. and 850 mm (31.5 in.) sq.[2]—
Weight (approximate)1500 kg[2]—
Dimensions (W x D x H)1580 mm W x 1640 mm D x 1680 mm H (nominal)[2]—
Air supply3.5-6 bar[2]—
Vision system typeOn-the-move telecentric XY camera with simultaneous look at stencil and board[2]—
Configuration—50/60 Hz[1]
Largest Single Load—6 Amps[1]
Full Load Current—10 Amps[1]

Plan your fab

Building a Assembly / SMT process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org