Waferpedia

Comparison ledger

1000versus1000 E-Beam

CHA 1000, CHA 1000 E-Beam, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1000CHA
OEMCHACHA
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCHA 1000CHA 1000
Specifications
Configuration6 Pocket E-gun[1]CTI 10 Cryopump with lines, cable and compressor[3]
System Base Pressure5x10^-7 Torr[1]—
CategoryDeposition[2]Deposition[4]
Wafer size5 inch[1]—
Equipment typeEvaporator system[2]E-Beam Evaporator[3]
E-gun6-pocket[1]—
Power supplySR 10 Power Supply[2]—
Wafer handlingTri Dome System 5" wafers (21 wafers total)[1]—
Pump down rateto base pressure in under 60 minutes[1]—
Deposition controllerInficon Deposition Controller[1]—
Rate controllerInficon Dep Rate Controller[2]—
SensorSingle Crystal Sensor (Fix Top Mounted)[1]—
ChamberWater Cooled Chamber[1]—
Automatic controlAutomatic Pump Down and Regen Controller[1]—
OEM—CHA[3]
Model—1000 E-Beam[3]
Vacuum & pumping—CTI 10 Cryopump with lines, cable and compressor[4]
Control & software—New touch screen valve controller (1 year warranty)[4]
Configuration & options—Lift Off Dome[4]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com