Waferpedia

Comparison ledger

017-0024-01 Prealignerversus200

Brooks 017-0024-01 Prealigner, GCA 200, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200GCA
OEMBrooksGCA
CategoryLithographyLithography
Wafer size—up to 6-inch diameter wafers; substrate size approximately 10 x 10 mm up to 100 mm, with 150 mm possible
Process node—i-line
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation—i-line
FamilyBrooks 017-0024-01 PrealignerGCA 200
Specifications
Manufacturer—GCA[1]
Tool type—Lithography[1]
Description—GCA 200 I-Line Wafer Stepper[1]
Exposure wavelength—i-line (365 nm)[1]
Exposure mode—Step and repeat[1]
Wafer loading—Manual wafer loading[1]
Supported piece parts—Down to smaller than 10 mm x 10 mm[1]
Supported wafer diameter—Up to 6 inches[1]
Maximum square die size—14.8 mm x 14.8 mm[1]
Lens—Olympus 2145[1]
Numerical aperture—0.45[1]
Mask reduction—5x[1]
Ultimate resolution—Better than 0.5 um in the center of the lens field[1]
Resolution across field—0.7 um isolated lines across the entire field[1]
Alignment tolerance—Better than 0.25 um global alignment; better than 0.15 um local alignment[1]
I-line intensity—About 420 mW/cm² at the wafer with a 1000 W Hg arc lamp[1]
Control—Computer controlled; recipes can be programmed and saved on hard disk[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu