Waferpedia

Comparison ledger

101-149-053 Gold Boosterversus4523 Deep Wedge

Branson 101-149-053 Gold Booster, Kulicke & Soffa 4523 Deep Wedge, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
4523 Deep WedgeKulicke & Soffa
OEMBransonKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterKulicke & Soffa 45xx
Specifications
Configuration1:1.5[1]heated chuck[4]
ManufacturerBranson[2]—
Model101-149-053[2]4523 Deep Wedge[4]
TypeGold Booster[2]—
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
OEM—Kulicke & Soffa[4]
Equipment type—Bonders[5]
Brand—Kulicke And Soffa[5]
Description—Vertical feed wedge bonder[5]
Included optics—Stereo zoom optics[5]
Ultrasonic generator—Ultrasonic generator[5]
Operating mode—Manual Z lever or semiauto mode[5]
Force control—Electronic force control[5]
Bonding materials—Aluminum wire, gold wire, and ribbon[6]
Applications—Simple discrete devices, complex hybrid devices, microwave devices, and deep cavity devices[6]
Deep access option—Deep access option with tail adjust system[6]
Bonding area—134 x 134 mm (5.3 x 5.3 inch)[6]
Throat depth—143 mm (5.6 inch)[6]
Gross table motion—140 mm (5.5 inch)[6]
Fine table motion—14 mm (0.55 inch)[6]
Mouse ratio—6:1[6]
Z motion system—DC servo / LVDT control[6]
Z travel low reset—6.6 mm (260 mil)[6]
Z travel high reset—12.7 mm (500 mil)[6]
Ultrasonic system—High Q 60 kHz transducer with PLL ultrasonic generator[6]
Low ultrasonic power—1.3 W[6]
High ultrasonic power—2.5 W[6]
Bond time—10-100 mSec / 10-1000 mSec[6]
Bond force—Force coil 10-160 gr.[6]
Wire termination—Clamp tear[6]
Wire feed angle—30/45 option 90[6]
Modes of operation—Semi-Auto, Manual, Stitch[6]
Temperature controller—Up to 250 ±0.5 C[6]
Electrical requirements—100-120/220-240V 10% 50/60 Hz 250VA max.[6]
Physical dimensions—680 mm (27") W x 700 mm (27.5") D x 530 mm (21") H[6]
Shipping weight—55 kg (122 lb)[6]
Net weight—31 kg (69 lb)[6]
Standards—Complies with UL and CE standards[6]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]inventory listing
  5. [5]jmind.comjmind.com
  6. [6]sunsemi.comsunsemi.com