Waferpedia

Comparison ledger

101-149-053 Gold Boosterversus4124 Gold Ball

Branson 101-149-053 Gold Booster, Kulicke & Soffa 4124 Gold Ball, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
4124 Gold BallKulicke & Soffa
OEMBransonKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterKulicke & Soffa 4124
Specifications
Configuration1:1.5[1]Incomplete, for parts[4]
ManufacturerBranson[2]Kulicke & Soffa[5]
Model101-149-053[2]4124[4]
TypeGold Booster[2]gold ball bonder[5]
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Bonding wire material—gold[6]
Wire diameter range—0.7 to 3.0 mils (17 to 75 microns)[6]
Cycle time—900 ms (including 100 ms bond time)[6]
Bond force—5 to 160 gr[6]
Bond time—10 to 100 ms[6]
Ultrasonic power, low range—1.3 W max[6]
Ultrasonic power, high range—2.0 W max[6]
EFO voltage—1200 Vdc, adjustable ball size[6]
Throat depth—5 in (127 mm)[6]
Reset to overtravel overall range—0.33 in (8.38 mm)[6]
Search/loop height range—0.02 in (0.51 mm) under reset to 0.02 in (0.51 mm) above lowest overtravel[6]
Table motion, gross—6.5 in (165 mm) diameter[6]
Table motion, fine—0.5 in (12.7 mm) diameter[6]
Bonding area—3.75 in x 3.75 in (95 mm x 95 mm)[6]
Chessman ratio—6:1[6]
Tail length—constant, electronically adjustable[6]
Optics—B&L or WILD stereo zoom microscope, top mounted[6]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]clara.nzclara.nz