Waferpedia

Comparison ledger

18 D SurfaceversusDFD 6240 Automatic Dicing

Blanchard 18 D Surface, Disco DFD 6240 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFD
Specifications
Voltage416 V[1]—
Phase3 Phase[1]3 Phase[3]
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]DFD 6240[3]
Asset #153970[1]—
Power416 V, 3 phase[1]3 Phase[4]
Configuration—Single Spindle (1.2KW)[3]
Machine type—Automatic dicing saw[4]
Frequency—50/60 Hz[4]
Blade hub type—Disco ZH05 Blade Hub Type[3]
Blade breakage detector—BBD[3]
Non-contact setup—NCS[3]
Chuck table—8" porous chuck table, default setting[3]
Spinner table—8" spinner table, default setting[3]
Cleaning—Cleaning by atomizing nozzle[3]
Rinse cleaning—Rinse cleaning spec[3]
Angle recognition—Angle Recognition System[3]
Alignment—Kerf Center Alignment[3]
Fan—Duct fan[3]
Electrical—3 Wire + Ground, 380 - 415 Vac[4]
Vintage—2005 Vintage[3]
OEM—Disco[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com