Comparison ledger
Besi DS 9000 E, Palomar 8000 i, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DS 9000 EBesi | 8000 iPalomar |
|---|---|---|
| OEM | Besi | Palomar |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2013 system debut |
| Control system | — | — |
| Generation | — | — |
| Family | Besi DS 9000 E | Palomar 8000 |
| Cited variants | — |
|
| Specifications | ||
| Voltage | 208 VAC[3] | — |
| Configuration | Single Phase[1] | upgraded to a 120kHz transducer[5] |
| Phase | 1 Phase[4] | — |
| Make | Besi / Datacon[1] | — |
| Model | DS 9000 E[1] | 8000 i[5] |
| Tool type | Bonder[1] | — |
| Wafer size | 8 inch[1] | — |
| Frequency | 50/60 Hz[3] | — |
| Current | 10 Amps[3] | — |
| Asset # | — | 81383[5] |
| Type | — | Wire Bonder[5] |
| Description | — | upgraded to a 120kHz transducer[5] |
| Vintage | — | 2019 Vintage[5] |
| System debut | — | Debut of the 8000i Wire Bonder/Ball Bumper in 2013[2] |
| Bond type | — | Thermosonic ball and wire bonding, ball bumping[6] |
| Cycle time | — | 0.125 sec/wire; 0.077 sec/bump[6] |
| Wire pitch | — | 50 μm using 20 μm wire[6] |
| Repeatability | — | +/- 2.5 μm, 3σ[6] |
| Deep access capillary | — | Standard: 11.10 mm; Optional: 11.94 mm / 15.88 mm / 19.05 mm[6] |
| Bond area | — | 304.8 x 152.4 mm (12" x 6")[6] |
| Wire spool size | — | 50.8 mm (2") double flanged spool[6] |
| Wire diameter | — | 17.8 to 50.8 μm (0.7 to 2.0 mil)[6] |
| Power | — | 200, 208, 220, or 240 VAC, 50/60 Hz, 30A, single phase[6] |
| Vacuum | — | -25 inHg (85 kPa)[6] |
| Air at bonder inlet | — | CDA: 60 psig @ 4 SCFM[6] |
| Dimensions | — | Height: 1,778 mm (70"); Footprint: 800 x 953 mm (31.5" x 37.5")[6] |
| Weight | — | 1,800 lbs. (816.47 kg)[6] |
| Control system | — | Linear motor/encoder (X/Y), voice coil/encoder (Z linear / Z rotary), Servo EFO/encoder[6] |
| Bonding mode | — | Thermosonic ball and wire bonding, ball bumping[6] |
| Capabilities | — | Ball bumping, stud bumping, wafer bumping, chip bumping, customized looping profiles[6] |
| Resolution | — | 0.10 μm X/Y axis[6] |
| Vision system | — | Cognex Series 8500[6] |
| Applications | — | Large complex hybrids, HB/HP LED arrays, optoelectronic packaging, chip-on-board (COB), system in packages (SiPs), specialty lead frames, automotive assemblies, flex circuits, multi-chip modules (MCMs), fine pitch devices, LEDs with running stitch[6] |
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